Used ASM iHawk Xtreme #9401029 for sale

Manufacturer
ASM
Model
iHawk Xtreme
ID: 9401029
Vintage: 2010
Wire bonder 2010 vintage.
ASM iHawk Xtreme Bonding Equipment is a state of the art thermosonic wire and ribbon bonding solution, capable of manufacturing highly reliable bonds at exceptionally high speeds and with extremely low cost. The system features industry leading temperature and surface temperature control, providing optimal results for even the most demanding microelectronic applications. ASM IHAWK-XTREME unit has been designed for maximum control and throughput enabling the highest production yields and lowest cost-per-bond possible. This machine offers superior capabilities in both the bonding process and maintenance, due to its advanced technology and innovative features. I HAWK XTREME utilizes a high voltage power supply for efficient power delivery and reliable real-time bond parameters, enabling optimizations even during high production runs. Additionally, a high-resolution optical microscope provides detailed images throughout the entire bond process, ensuring optimal melt and interconnect formation. The flex control feature on the tool places high importance on the reproducibility of the whole process by giving the operator control over heat, temperature and force profiles, allowing for the setting of bond parameters without the need for any adjustments. This not only simplifies operator skills but also ensures maximum bond integrity. The machine has been designed to enable high bond speeds as well as multiple bond shapes and sizes. It features a unique up-tower tooling which can accommodate bond wires in various shapes and configurations efficiently and reliably, and overall greatly enhances the machine's maneuverability. The asset can bond on metals, polymers and ceramics, as well as hybrid materials, and is designed to ensure superior bond performance and reliability given any material combination. In summary, ASM I HAWK XTREME Bonding Model is a high-speed, low-cost and highly reliable bonding equipment for complex microelectronic applications. Its advanced technology, superior control, versatility and reliability make it an ideal choice for any bonding job.
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