Used ASM iHawk #293642511 for sale

ASM iHawk is an automatic bonder designed and manufactured by ASM Pacific Technology Ltd., capable of accurately and quickly automated die attach process. ASM I HAWK bonder is an intelligent automation device that offers an all-in-one solution for die attach process in a chip-sized platform. IHawk bonder is light weight, fast and more accurate than traditional manual bonding. It is designed to automate the die attach process while maintaining exceptional yield and consistent quality. It is suitable for most types of interconnection technologies, such as custom dies and epoxy or eutectic die attach. I HAWK bonder features an integrated and patented vision system, allowing it to effectively move from one location to the next, accurately aligning and placing die, as well as recognizing correctly mounted and correctly connected dies for bonding. ASM iHawk's environment friendly, annealing program ensures that after the die attach process, the wiring and substrate woodwork is complete in a single operation. The superior features of ASM I HAWK bonder include high accuracy, high repeatability, fast cycle time and a user friendly, intuitive Windows interface. In addition, the unit is designed to protect component quality by minimizing thermal stress experienced by the component during the die attach process. IHawk bonder provides a comprehensive analytics solution across its entire process, enabling users to monitor and adjust the die attach process as needed, as well as to create audit trails. Moreover, the bonder can be used with multiple substrates and with a wide range of packaging automation options. I HAWK bonder offers enhanced productivity, flexibility and quality, making it suitable for most international semiconductor assembly processes. Overall, ASM iHawk bonder is an ideal solution for semiconductor facilities looking to increase throughput and efficiency while reducing wastage.