Used ESEC 3100 Plus #293645975 for sale

ESEC 3100 Plus is one of the most advanced and energy efficient bonders available in the marketplace. It is a state-of-the-art equipment specifically designed for the continuous bonding of die attach, leadframe, and other substrate substrates. 3100 Plus utilizes a high-precision bond head, powered by a brushless servo motor with a bandwidth of up to 400 kHz. This provides a bond rate of up to 4000 bonds per second, which is unparalleled in the industry. ESEC 3100 Plus is built with advanced thermal control and monitoring systems, making it capable of consistently producing quality bonds that meet and exceed the most demanding requirements. The system includes advanced thermal sensors, allowing for precise and repeatable temperature control of the bonding process. An integrated laser unit measures bond strength during the process, and the machine includes a suite of automated features that streamline and optimize production runs. 3100 Plus is also certified to operate with a wide variety of surface chemistries, materials, and structures. This allows the tool to be used in a variety of bond tasks, from chip on board to lead frame and QFN solder attach. It also allows for a wide range of process parameters, including force, temperature, length, and displacement to accommodate any bond need. ESEC 3100 Plus is a reliable and robust tool for quality bond production. With its wide range of process capabilities, advanced thermal control and monitoring systems, and fully automated features, it is perfect for high-precision production and reliable repeatability. When combined with its energy efficiency, 3100 Plus is an invaluable asset for the production of complex and high-reliability bonds.