Used ESEC 3100 Plus #9396956 for sale

ESEC 3100 Plus Bonding Equipment is one of the most advanced and reliable bonding systems on the market. Featuring an advanced and intuitive user interface, this powerful device speeds up the bonding process and produces accurate, reliable results. The system is built on a unique patented bonding technology with advanced capabilities, enabling it to bond multiple substrates at once and complete complex tasks with ease. 3100 Plus is a state-of-the-art device with robust design, productivity, and accuracy. Its robust construction ensures it can withstand the rigors of production and meet the most demanding requirements, enabling efficient, reliable performance in all types of applications. From small components, to large circuit boards, ESEC 3100 Plus handles a wide range of materials, ensuring precise and accurate bonding results. The unit is ideal for applications where speed and flexibility are a concern. It features a fast bonding cycle time and adjustments for bond height, width, and pressure. It also comes with special Pressure Sensor Technology, which allows for the precise adjustment of point-to-point contact pressure and an automatically controlled air gap. This helps to reduce the chances of contaminants such as flux or dust entering the bonding area, resulting in a much cleaner and repeatable bond. 3100 Plus provides unparalleled precision, with sub-micron adjustable point-to-point contact pressure, along with high resolution air gap adjustment. This allows for precise and accurate bonding of a wide range of substrates, including automotive, aerospace, medical, and other advanced applications that require intense precision. Furthermore, the machine is designed with exceptional safety in mind. Its advanced safety mechanisms monitor and control various parameters, like bonding temperature, moisture, humidity, and other environmental factors, ensuring a safe operation. It also has a built-in temperature/pressure monitoring tool, enabling precise bonding conditions at all times. ESEC 3100 Plus Bonding Asset is the perfect tool for precise, reliable, and safe bonding of intricate substrates. Its advanced bonds and fast cycle time combine to give you maximum control and precise results in all types of applications.