Used ESEC TSUNAMI W3100 Plus #9265580 for sale

ESEC TSUNAMI W3100 Plus is a high-end automatic wedge bonder that is used for complex and demanding precision wire bonding applications. The machine is ideal for applications involving fine pitch and tight loop interconnects, being able to perform a wide range of wire sizes with unparalleled precision and repeatability. The machine is powered by a state-of-the-art, ultra-precise stepper motor equipment and accompanied by intuitive, easy-to-use software. This allows the engineer to determine the exact working parameters for each wire bonding operation and to program the machine accordingly. The motor system is centralized on the x-axis of the bonder, allowing for fast looping and repeatable accuracy. W3100 Plus is equipped with high-speed scanner components, allowing for quick and accurate alignment of the bond pad onto the device under test (DUT). The unit also boasts temperature regulation capabilities, allowing the engineer to set the temperature of the heat plate to a constant temperature to create even, uniform bonds. The machine also benefits from a built-in wire feeder machine, allowing for quick and easy changes of wire spools and sizes. The bonder can be used with a wide variety of wires, including gold, aluminum, copper, and palladium wires. ESEC TSUNAMI W3100 Plus is packed with features and benefits that make it the ideal bonding solution for many applications. Its motor tool is capable of unparalleled accuracy and repeatability, while its intuitive software allows the engineer to make quick and accurate changes to the bond parameters for every wire bonding job. The built-in temperature control and wire feeder asset make quick work of tedious jobs, and the high-speed scanner components provide exceptional accuracy for aligning the bond pad to the DUT. This bonder is a reliable and dependable choice for any precision wire bonding applications.