Used ESEC TSUNAMI W3100 Plus #9265581 for sale

ESEC TSUNAMI W3100 Plus is a high-precision, high-pressure bonder designed for use in a wide range of precision applications, including MEMS, LEDs, ICs, Hybrid and Flip Chip packaging, and Micro-electro-mechanical systems (MEMS). The bonder utilizes a unique, patented, heated-platen equipment which allows precise, repeatable, and reliable bonds to be produced. The precision bonder features an integrated workstation with a vacuum chuck, thermocoupler, and pulse rate generator to ensure accurate bond time and temperature. The workstation is capable of handling up to 8" wafer and flip chip sizes. The heated platen can support up to 350 psi of pressure, and temperatures up to 240°C. W3100 Plus is also equipped with a six-axis, linear motion control system that allows for a wide variety of bond angles and configurations. The bonder utilizes a unique heated-platen unit that requires minimal maintenance and no additional cleaning or lubrication. The platen is highly resistant to wear and can be easily removed from the bonder for cleaning and maintenance. The bonder is also designed to maintain a pristine bond area by utilizing proprietary anti-static and anti-corrosive materials that prevent contamination and contamination-induced defects. ESEC TSUNAMI W3100 Plus is extremely easy to use and can accommodate a wide variety of bond materials and configurations. The intuitive user interface allows for simple setup, intuitive nameplate management, and real-time procedure tracking. Additionally, the intuitive user interface can communicate with factory automation systems and is capable of setting up recipes on the fly or uploading preset recipes for different processes. For increased accuracy, W3100 Plus is equipped with a built-in vision machine that can be used to monitor the bond integrity in real-time. The tool feature an integrated 3D camera that maps two planes of the bond area and monitors for any misalignment or irregularities. This feature also allows the user to quickly adjust the bond parameters and optimize the bond parameters for increased accuracy. ESEC TSUNAMI W3100 Plus is an ideal bonder for demanding precision applications that require repeatable, high-pressure, and high temperature bonds with minimal maintenance and setup. The intuitive controls, flexible configuration options, and advanced vision monitoring asset make W3100 Plus perfect for any micro-electronic and MEMS packaging application.