Used ESEC TSUNAMI W3100 Plus #9360824 for sale

ESEC TSUNAMI W3100 Plus is a high-performance bonder designed for precision bonding of microelectronic components. With its advanced technologies, the bonder can provide the precision and reliability required by today's most demanding processes. The bonder is designed to work with a myriad of materials, from gold to copper to polymers. Its advanced technology utilizes a dynamic temperature profile, allowing for optimum bonding times for the specific materials being bonded. In addition, the bonder utilizes patented multi-zone thermal energy to precisely monitor and control the placement and temperature of the bonding tip. This ensures that each bond is placed accurately and consistently, reducing the chance of defects in the bonding process. The bonder also features a number of safety and convenience features, such as a lockable safety cover and a touchscreen interface for ease of use. The bonder includes a variety of advanced functions, including transmission waveform control, optical microscope use, onboard diagnostics, and a real-time monitor window. Through the transmission waveform control, users can select the strength of the bonding pulse for different applications. The optical microscope allows users to monitor the quality of a bond, view microscopic structures, and investigate gem assembly defects. The onboard diagnostics provide information about the bonder's performance and temperature, while the real-time monitor window provides a preview of the bond in progress. The bonder is also designed to be compatible with a wide variety of automation systems, allowing users to integrate it into an automated production line. The bonder is designed to be compact and lightweight, making it easy to transport and install. The bonder features an onboard computer control system with Windows compatibility, allowing users to access data and control the bonder remotely. Designed for the most precise and reliable bonding applications, W3100 Plus is a powerful and reliable bonder. With its advanced temperature profile technologies and other features, the bonder provides users with the utmost precision and reliability, ensuring that user's projects are completed with the utmost care and accuracy.