Used ESEC TSUNAMI W3100 Plus #9360826 for sale

ESEC TSUNAMI W3100 Plus bonder is a versatile, precision wire bonder that is able to handle both stacked die and 2.5D designs. The machine is packed with features to provide a reliable and efficient manufacturing process. The TSUNAMI W3100 Plus has an 8-axis machine design that includes dual degree of freedom which allows for greater flexibility and accuracy for handling a wide array of wire diameters, pitch sizes, wire length, bond force and bond angle. The tool contains a powerful, 8-channel In-Feeder that feeds wires accurately and with precision which is vital for high yields and reliability in the bonding process. Also included is an adjustable wire feed platform which is used to ensure precise and reliable yields by reducing wire pull-off. The TSUNAMI ESEC TSUNAMI W3100 Plus is equipped with an advanced, 3-axis vision alignment equipment which is used to identify wire bonding processes in order to reduce scrap and provide a reliable and efficient process. This is done by tracking various parameters of the wire feed, including core insulation, wire diameter, and pitch. The vision system is also able to detect mispositioned dies, opening up the ability for automatic correction of any mispositioned dies. The TSUNAMI W3100 Plus is equipped with an inert gas atmosphere environment that provides reduce risk of contamination and oxidation to sensitive bonded wires. Additionally, it features a FlowGuard displacement unit which is a fast and reliable process to remove scratches and oxidation from wire contacts prior to bonding. This reduces the number of bonding failures that present with common defects. The machine also features a comprehensive built-in diagnostics machine, designed to optimize and detect any potential or existing problems within the bonding process. The tool will inform the user of any issues and will provide suggestions as to how to resolve these issues quickly and effectively. The TSUNAMI ESEC TSUNAMI W3100 Plus is an all-encompassing and versatile bonder designed to meet the highest expectations of manufacturers seeking precision and reliability in wire bonding. It offers users high yields, improved accuracy, and cost reduction for stacking die and 2.5D designs.