Used F&K DELVOTEC 4500 #293610428 for sale

F&K DELVOTEC 4500 bonder is an advanced technological device used in the production of electronic components. The device consists of a robust and reliable bonding system that is able to bond components using Thermal or Ultrasonic technologies to deliver superior yields and a wide range of materials. 4500 bonder offers a sophisticated, automated bonding process with intuitive operation and flexible programming. F&K DELVOTEC 4500 bonder offers a wide range of surfaces to lend onto and can handle boards, panels, or even components as small as 0.2 mm in size. The bonder includes a multitude of options to fine-tune and manage parameters such as bonding pressure, temperature, and speed. Additionally, 4500 bonder boasts an easy and intuitive application, allowing users to enter values quickly and accurately and make adjustments on-the-fly to get the most accurate and efficient results. When it comes to material selection, F&K DELVOTEC 4500 bonder can accommodate a wide range of materials with its high-performance technology. From gold and aluminum wire, to silver and copper-based contact materials, 4500 bonder can provide a bond that is suitable for almost any application. Additionally, F&K DELVOTEC 4500 bonder includes an automatic de-paneling function to provide contact plates with the perfect cut. In terms of safety, 4500 bonder has several measures in place to protect from static charges, excessive temperatures, and foreign objects. The bonder also features vibration control via active sensors, allowing for smoother and more consistent contact during operation. In addition to its technological features, F&K DELVOTEC 4500 bonder also features a high quality build, allowing for longer and more reliable operation. 4500 bonder is highly user friendly and is designed for greater efficiency and performance, reducing production costs and lead times. F&K DELVOTEC 4500 bonder is a reliable and dependable machine that provides the perfect solution for a range of bonding demands and processes.