Used HANWHA TECHWIN SRF30124NS #9352074 for sale

HANWHA TECHWIN SRF30124NS
Manufacturer
HANWHA TECHWIN
Model
SRF30124NS
ID: 9352074
Vintage: 2008
System 2008 vintage.
HANWHA TECHWIN SRF30124NS is a high-precision bonder. It's specially designed for high-accuracy prototyping and production applications. This bonder offers superior reliability and precision for the most delicate electronics assembly applications. It features a unique flexural-joint technology, which uses a patented process to greatly reduce chip-to-chip variation and drift. This bonder is integrated with a highly accurate linear motor, and offers excellent dynamic performance, with speeds of up to 5,000 RPM. It also includes a patented digital-stereo vision system to guarantee alignment accuracy. The bonder's precise XYZ resolution of 0.2 μm enables the assembly of high-precision components. This makes it a perfect choice for manufacturing miniature and microdevices using extremely precise electronic components and boards. It also includes an onboard imaging system that allows the operator to quickly move the bonder's head to the correct XYZ position, even with difficult to access structures. The bonder is also equipped with multiple bonding capabilities, including automatic wire bonding, thermocompression, thermosonic, ultrasonic, convection reflow, and laser processing. This allows the operator to quickly and accurately bond components of various sizes. The bonder's user-friendly interface makes it easy for operators to switch between various processes. In addition, SRF30124NS features an integrated dual process control system that helps keep the operator informed of the exact position of the bonded components and of all process parameters. This ensures that appropriate corrective action can be taken before any damage is done. The robust, reliable design of the bonder ensures repeatable performance and maximum uptime. HANWHA TECHWIN SRF30124NS is the perfect choice for precision electronics assembly. It provides superior precision and accuracy, integrated process controls, and bonding capabilities that enable the assembly of high-precision components. The user-friendly interface allows operators to quickly and easily switch between processes for optimized production results.
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