Used IWATSU TT-508 #9201200 for sale

IWATSU TT-508 is a bonder, designed for precision and high-speed Wire Bonding applications. The unit is equipped with a high-precision image processing system, which provides optimum wire shape bonding accuracy and reliable results even in high-volume production environments. It is capable of handling multiple wire sizes and shapes, as well as wire materials such as aluminum, copper, gold and kovar. TT-508 carries out the precision wire bonding process automatically, with an automated wire trimmer that accurately trims the wire before the bonding process. The trimmer uses an ultrasonic blade that accurately tightens the wire to minimize the risk of wire breakage during bonding. This ensures the highest quality bonding connection. IWATSU TT-508 has a high-speed, high-precision Stitch Image Processor (SIP) that provides superior performance and accuracy. The SIP technology is optimized for the highest accuracy and provides the capacity for up to 500 bonds per second. The machine uses a patented shape recognition algorithm, allowing the machine to accurately identify wire shapes for precise wire bonding. TT-508 features an automated Head Addressing System (HAS) equipped with real-time online monitoring capabilities and an automated memory check. The HAS ensures optimal head positioning and accuracy while delivering epoxy-filled connections on a wide variety of substrates. The machine is designed with an integrated safety system to protect against electrical shocks, as well as a low-maintenance menu-driven operation that is easy and intuitive to use. IWATSU TT-508 is an excellent choice for manufacturers seeking reliable and accuracy wire bonding on a wide range of applications. The machine's high-precision image processor and advanced SIP capabilities deliver increased reliability and accuracy for high-speed, high-volume wire bonding processes.