Used KARL SUSS / MICROTEC ABC 200 #9384841 for sale

KARL SUSS / MICROTEC ABC 200
Manufacturer
KARL SUSS / MICROTEC
Model
ABC 200
ID: 9384841
Wafer bonder.
KARL SUSS / MICROTEC ABC 200 is a fully automated precision bonding system designed to consistently bond a wide range of materials and substrates. This bonder can handle substrates from 100 mm to 240 mm and has process temperatures up to 200°C. Created with the needs of modern industry in mind, MICROTEC ABC200 offers excellent precision and repeatability as well as user-friendly automation. An XYZ table allows for easy transportation of substrates to the bonding head, which is protected from external factors such as dust and dirt. The bonder comes with a number of features that maximize process control including a temperature profiling system, light-curtain monitoring and an integral vision system. The SCADA software package also comes with a range of tools to help optimize process parameters and reduce setup costs. The bonder contains a semi-automated process chamber with heating, cooling, and lamination functions, capable of processing up to 200mm samples. All the processes in the chamber are interactive, which includes: heating, laminating, cooling, and measuring parameters using external sensors. For maximum accuracy and repeatability, the XYZ table automatically calculates the position of the bonding head relative to the applications to be bonded as well as the temperature of the substrate and the gap distance in real time. The bonder can be integrated with a number of other systems, including clean room equipment, curing ovens, process testing systems, premium cleaning systems, and robotic handling systems. It can also be used to process a range of parts from single-sided to multi-layer substrates with a range of metal alloys, silicones, polyolefins, and epoxies. KARL SUSS ABC-200 bonder is ideal for use in a variety of industries including automotive, medical device, and consumer electronics.
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