Used KARL SUSS / MICROTEC SB 6 #293639159 for sale

Manufacturer
KARL SUSS / MICROTEC
Model
SB 6
ID: 293639159
Wafer Size: 6"
Bonder, 6" 1995-1996 vintage.
KARL SUSS / MICROTEC SB 6 is a high-precision bonder that is ideally suited for demanding production applications and volume manufacturing in the electronics and optics industry. With its fully automated processes, MICROTEC SB 6 allows for high-quality bonding, with an accuracy of 1 μm, and a cycle time of only 18 seconds, making it a very efficient and cost-effective production tool. KARL SUSS SB6 provides efficient and reliable operation with its two-plane, two-camera vision system that allows for the precise placement of components for bonding. The bonder is designed with a novel 2-axis Vision Module, which is used to accurately locate the feature of the components and establish a bonding profile. This feature is combined with state-of-the-art optics, which can perform alignment, placement, identification and sequencing of components for timely and accurate bonding. KARL SUSS / MICROTEC SB6 also offers a range of operation modes for different bonding requests, including standard, auto-bonding, manual, manual auto-bonding and manual-static bonding. The standard operation mode is well suited for general bonding requirements, while the auto-bonding mode is used for higher accuracy requirements, and it can address most optics manufacturing issues. The manual mode allows the operator to monitor the bonding process and make hands-on adjustments as needed. Manual auto-bonding and manual-static bonding are special modes that are used for advanced process control. The system also offers a variety of flexibility options in terms of bond configurations and part requirements, allowing for diverse part sizes and shapes. KARL SUSS SB 6 also provides integrated RF heating capability, allowing for the reliable and accurate connection of sensitive electronic components. MICROTEC SB6 is an ideal solution for high-volume and small-volume manufacturing, with its combination of precision accuracy, efficient operation and a wide range of bonding capabilities. It is also suitable for challenging applications in the electronics and optics industry. The bonder stands out due to its sophisticated vision system and RF heating power, allowing operators to achieve reliable, accurate and repeatable bond results.
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