Used MEI 1204B #9096415 for sale

MEI 1204B is a single-axis bonder designed for microelectronics applications requiring accurate and repeatable die-attach and wire-bonding operations. 1204B creates reliable and repeatable bonds utilizing a choice of light-touch or pressure bonding methods, and its high-precision control and advanced features make it an ideal choice for applications with demanding accuracy requirements. MEI 1204B offers precise control of x-y alignment and height adjustment through its closed-loop motion control system, providing repeatable bond placement accuracy of +/- 5µm. Both light-touch and pressure bonds can be achieved using 1204B, with a light-touch bond height adjustment range of 0 to 3.25mm, and pressure bonding adjustment range of 0 to 5.75mm. MEI 1204B also offers the flexibility of up to 20 user-defined process programs and 40 user-defined tooling fixtures. This allows for pre-programming of complex bonding sequences, allowing for rapid and reliable transfer from one process operation to the next. 1204B also offers a wide range of bonded wire diameters, allowing for hard gold, aluminum, or copper wire to be used with ease. MEI 1204B's advanced design and features make it a reliable and accurate bonder for microelectronics applications. 1204B's robust construction and closed-loop motion control system enable precise and repeatable bond placement, with repeatability of +/- 5µm. MEI 1204B's flexibility and pre-programmed process sequences, combined with its range of bond wire diameters and ability to handle both light-touch and pressure bonds, make it an ideal bonder for high-precision microelectronics applications.