Used OHASHI FAM-200SDNK #9210997 for sale

Manufacturer
OHASHI
Model
FAM-200SDNK
ID: 9210997
Vintage: 2009
Auto alignment machines PCB: Alignment & pre bonding of FPC Process type: Alignment & pre bonding of FPC on PCB Patrites: 2000 (H) Work size (PCB): Minimum: 20 x 20 mm Maximum: 142 x 230 mm Work thickness: Including component height: Maximum: 10 mm FR4 (8 Layers substrate) Work handling: Manual loading & unloading by operator Carrier size: 250 (X) x 400 (Y) x 10 (t) mm FPC Size: Minimum: 20(X)x 20(Y) mm Maximum: 40 (X) x 60 (Y) mm Thickness:25 µm-60 µm FPC Tray size: 250 (X) x 400 (Y) x 3 (t) mm Performance: Bonding accuracy: ±20 µm (FOB ) Machine cycle time: 7.5 sec BT: 0.5 sec contains Excluding work loading & unloading 2009 vintage.
OHASHI FAM-200SDNK is a fully-automatic desktop wire bonder from OHASHI Inc., a leading manufacturer of automated wire bonding machines. Using a high-precision, sophisticated wire bonding head, FAM-200SDNK can reliably bond a wide range of wire types in various configurations, making it an ideal choice for small- to medium-volume production runs. OHASHI FAM-200SDNK utilizes a robust servo-controlled stepping motor, precision ball screws, and load cells for position and force control of the bond head, allowing for smooth and precise wire bonding even at high speeds. A unique two-axis alignment system helps to ensure precise wire placement. The machine includes an easy-to-use programmable LCD touch-screen controller that can store up to 100 bond programs. This allows users to quickly switch between different processes within a production run, enhancing versatility and efficiency. FAM-200SDNK is also equipped with a wide range of safety features including safety light curtains, boning head collision protection, wire breakage detection, and monitor guard alarms. Furthermore, the machine is designed to adjust wire tension and feed rate using an innovative tension control system. Overall, OHASHI FAM-200SDNK is an ideal solution for industries that require robust wire bonders for small to medium-volume production runs. Its advanced features make it highly accurate and reliable, offering superior bonding quality and greater productivity.
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