Used ORTHODYNE M 360C #9284364 for sale

ORTHODYNE M 360C is an automated bonding equipment designed for rapid, accurate wire bonding. Featuring an adjustable arm and a high-precision camera, the device allows for precise placement of bonds on semiconductor chips, capacitors, and other electrical components. The system is equipped with a high-speed stepper motor drive, which enables accurate, precise motion control. The unit also has onboard memory, so that it can remember single-wire or multi-wire sequences, making it ideal for high-volume production. ORTHODYNE M360C features an adjustable arm, which can be set up to reach components and chip packages of various sizes and shapes. The machine is also capable of single- or dual-wire and multi-wire bonding. In addition, the integrated high-precision camera is able to detect the exact bonding coordinates for accuracy, allowing for precise placement of wires and other components. The device also supports various wire-bonding techniques, including wedge and straight bonding, as well as corner and loop bonding. The integrated precision micropositioner makes wire loop formation fast, accurate, and easy, reducing production time and costs. M360 C is easy to use, with simple setup and operation. The operator control panel provides easy access to all tool parameters, allowing for easy customization of the asset to suit individual applications. In terms of safety, ORTHODYNE M360 C has multiple safety features, including an emergency stop button, an emergency off switch, and an overload indicator. In addition, the model also has a temperature-regulated wire-bonding head and a double-shell construction to further ensure user safety. Overall, M360C is a reliable and high-performance automated bonding equipment. Its adjustable arm, high-precision camera, and variety of wire-bonding techniques make it ideal for a wide range of microelectronics applications. The device also has a range of safety features, making it a safe and cost-effective solution for the production of high-quality semiconductors and other components.