Used ROYCE BPT / BST 650 #9145006 for sale

ROYCE BPT / BST 650
Manufacturer
ROYCE
Model
BPT / BST 650
ID: 9145006
Bond test system.
ROYCE BPT / BST 650 is a DLH-type bonder designed for low temperature-bonding applications. This bonder utilizes thermally activated Nickel‐titanium shape memory alloy (NiTi SMA) wire to cause bonding between two surfaces. Primarily, BPT / BST 650 is used in small electronics assembly and packaging operations where precise and reliable low-temperature bonding is required. ROYCE BPT / BST 650 utilizes "drive-thread" techniques to bond materials together. In this technique, a precise amount of energy is used to heat the NiTiSMA wire which then generates a torque that drives the wire into the material surfaces. The bonder is equipped with the necessary control electronics to monitor and manage the thread tension and provide the maximum amount of energy to the NiTi SMA wire for efficient bonding. BPT / BST 650 features a compact design with a bonded area of up to 600 x 300 mm and a maximum bonder head length of 250 mm. Its most advantageous feature is its ability to control the bonding wave and thread tension, allowing it to be used for very small assemblies with thin components. Additionally, its small footprint makes the bonder well-suited to a variety of environments and can easily fit in tight spaces. In operation, the bonder can achieve close to 90% of its peak bond strength at temperatures ranging from -20°C up to 120°C. This makes it ideal for a range of low temperature applications, including bonding of materials with low adhesion. The bonder also has a long reliability remit, providing reliable bonding of more than 5,000 wires over a long life cycle. This bonder's low power consumption and light weight make it easy to move and setup for a wide variety of applications. Overall, ROYCE BPT / BST 650 is an ideal low temperature bonder for small electronics assembly and packaging operations. It features a compact design and can achieve close to 90% of its peak bond strength at temperatures ranging from -20°C up to 120°C. Additionally, its low power consumption and light weight make it easy to move and setup for a wide variety of applications. With its reliable bonding capabilities and durable construction, BPT / BST 650 is a great choice for a variety of low temperature bonding applications.
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