Used SHINKAWA COF-1000 #293585688 for sale

SHINKAWA COF-1000
Manufacturer
SHINKAWA
Model
COF-1000
ID: 293585688
Flip chip bonder.
SHINKAWA COF-1000 is a state of the art bonder offering excellent performance and yields. It is a fully automatic, high-precision bonding machine that can perform a wide range of operations. COF-1000 is equipped with a stable and reliable X, Y, and Z-axis stages that allow for precise and accurate positioning of the component to be bonded. It is capable of handling flat, punch, wire, and frame type components. SHINKAWA COF-1000 can be loaded with two types of heating plates on its upper and bottom stages. The top heater and the bottom heater, equipped with high-precision controlling functions, can be adjusted to different temperature zones for ideal heating. COF-1000 features a robust pressure/time control system for consistent bonding results. Each heat zone can be set and adjusted with ease, providing a versatile platform for bonders targeting high-precision applications. Furthermore, SHINKAWA COF-1000 includes the latest high-speed vision-based bond-inspection system ensures error-free bond placement. Automatic fine soldering regulation allows for high-precision adjustment of the soldering depth, guaranteeing reliable and repeatable soldering results. Using the advanced proprietary software and optical sensors, COF-1000 can identify and efficiently inspect the defects or malformations in any component. In short, SHINKAWA COF-1000 is a capable and efficient bonder that guarantees high-precision results and increased yields. It is an ideally suited solution for a wide range of large-scale bonding and soldering work, making it a perfect fit for any manufacturing process. Whether you need to bond flat, punch, wire, or frame components COF-1000 will help you get the job done quickly and precisely.
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