Used SHINKAWA SBB-410 #9260767 for sale

SHINKAWA SBB-410 is a bonder designed to automate the bonding process in a wide variety of applications. It is a precision-engineered, self-contained machine capable of performing precision alignments and bond processes. The machine is suitable for use in a variety of production environments including semiconductor wafer bonding, chip-on-chip, MEMS and medical device assembly. SBB-410 is an efficient and reliable bonder equipment for precise alignments and accurate bonding results. It features a closed-loop temperature controlled bonding system and a high-precision x-y motion unit for accurate 3D positioning. SHINKAWA SBB-410 features a range of configurable modules including a light source, lens, robot, camera, and gesture-based user interface. It also has an optional vision machine for detecting and sorting parts. This tool is designed to simplify operation and increase throughput. The machine is able to perform a variety of bonding processes including ball bonding, wedge bonding, and flip chip bonding. It has a bonding speed of up to twelve bonds per second, enabling efficient production. The robot arms of the machine provide 360 degree rotation and a 500 mm working area for more accurate 3D positioning. SBB-410 is also equipped with a vacuum cleaning asset for fast and easy removal of particulates. The machine also has a manual override feature for simple control. SHINKAWA SBB-410 is able to store multiple recipes for each application, providing fast setup times and increased productivity. The machine is designed to be easy to use and maintain, making it suitable for high-volume production. SBB-410 is a high quality bonder model designed to meet the needs of a variety of production environments. It is easy to use, cost-effective, and capable of providing high-precision results.