Used UNITEK MICROPULL III #9020474 for sale

UNITEK MICROPULL III is a versatile and powerful bonder capable of handling various micro-engineering processes, including micropulling, microwelding, and micropotting. This bonder uses a powerful combination of advanced computer vision, force sensing, and digital control to create and control precise lines and patterns with the utilization of specialized bonding technologies. The bonder is designed for use in micro-electronic packaging, micro-optics, and micro-mechanical engineering applications. MICROPULL III has a powerful and easy to use graphical user interface for setting parameters such as voltage, current, and temperature. Syncronized motion is provided by a patented, high traction linear drive system. A built-in vacuum system reduces adhesion to foreign debris. The adjustable parameters on the bonder allow precise control of the bonder's characteristics, including temperature, travelling speed, and force. This enables the users to effectively tune and control the shape, size, and depth of the bonds being created. UNITEK MICROPULL III has a wide range of accuracy and precision. It can achieve bonding with micron accuracy, allowing for lamination of various components with a variety of thicknesses. The bonder is equipped with a variety of sensors for process monitoring and autonomic process control. These sensors include temperature, pressure, light, and flow. Automated alignment and GPS coordinates are also features in MICROPULL III for achieving the best possible accuracy in a bond. UNITEK MICROPULL III is an efficient but powerful bonder that offers a high level of precision and control while keeping costs low. This versatile bonder is ideal for use in many industries including medical, optical, aerospace and automotive. Designed with standard safety systems, MICROPULL III is capable of effectively creating and controlling precise micropulls, microwelds, and micropotting techniques. With its intuitive interface and robust feature set, UNITEK MICROPULL III makes quick work of any micro engineering application.