Used TOYO UV-1215S #9156202 for sale

TOYO UV-1215S crystal growing, sawing and slicing equipment is an advanced semiconductor wafer processing machine that is designed to grow, saw and slice high quality crystals from cryogenic materials. This machine features a crystallizing chamber that can hold up to 500mm of semiconductor wafers, and can hold wafers up to 2mm in thickness. The chamber is equipped with Peltier-controlled cooling and can reach temperatures as low as -50°C. A built-in UV lamp and laser module helps to evenly heat the interior of the chamber, allowing for efficient crystal growth. The sawing and slicing process takes place in UV-1215S's two parallel saw chambers. Each chamber is equipped with a pair of 200W lasers for cutting through the crystal material. The lasers are powered by a dedicated power supply and feature a dynamic cooling system to ensure their longevity. TOYO UV-1215S also features a vision unit with a high-resolution CCD camera, capable of capturing images of individual crystal slices. This aids in ensuring the precise slicing of the crystal material. UV-1215S is also fitted with a motorized stage for loading and unloading the wafers, as well as a PLC unit for controlling the overall operation of the machine. Additionally, TOYO UV-1215S is capable of automatically adjusting the laser power during cutting, depending on the material being cut. The machine is also equipped with an air-shield tool, ensuring that the crystal material remains contaminant free during processing. Overall, UV-1215S is the ideal solution for growing, sawing and slicing a wide range of cryogenic materials, offering superior crystal growth, increased production speed and consistent cutting results. In addition, the asset remains cost-effective, helping to minimize operational costs while helping to ensure precision and quality results.