Used CANON / NEC BESTEM-D01R #9251322 for sale

CANON / NEC BESTEM-D01R is a state-of-the-art die attacher designed for high-precision semiconductor manufacturing. Its compact and robust design, combined with its precision components, sets it apart as one of the best die attach solutions available today. NEC BESTEM-D01R offers remarkable accuracy, with a tolerance of ±20μm, and the ease of use of a robot-driven equipment. It is capable of applying consistent quality and force to dies of various shapes and sizes with speeds of up to 1500mm2/s, making it ideal for high-volume or high-precision applications. Its features make it suitable for a wide range of applications--anything from bonding memory chips to integrated circuits and optical components. CANON BESTEM D-01R has dual-pressure control, allowing users to accurately adjust the die attachment pressure to the die size. This helps to prevent damage due to excessive pressure or insufficient pressure, thus ensuring consistently reliable chip attachment. NEC BESTEM D-01R comes with a hydraulic pump system, allowing for optimal control of the pressure distribution, as well as an intuitive software interface that simplifies operation. An enclosure ensures a dust-free environment and optical component protection. BESTEM D-01R is configured with an industrial-grade control, which provides users with accurate temperature control, stability, high-speed processing, and the ability to precisely set pressure accuracy levels. The computer-controlled robotic arm allows for easy positioning, making the die attach process quick and efficient. For added flexibility, BESTEM-D01R is available in three versions: stand-alone, tabletop, and custom wall-mount. This allows users to choose the unit that best suits their production process. Additionally, this die attacher can be integrated into NEC Production Line Control Machine, thereby streamlining production and reducing costs. In summary, CANON / NEC BESTEM D-01R is a reliable and precise die attacher that utilizes a robot-driven tool and cutting-edge technology to achieve accurate die attachment. Its dual-pressure control, intuitive software interface, and ability to integrate into CANON Production Line Control Asset make it an ideal solution for the semiconductor industry.