Used CANON / NEC BESTEM-D01R #9395477 for sale

CANON / NEC BESTEM-D01R
ID: 9395477
Wafer Size: 12"
Vintage: 2012
Die bonder, 12" 2012 vintage.
CANON / NEC BESTEM-D01R die attacher is an advanced and precision automatic die bonding tool. This tool is designed for attaching small semiconductor dies to substrates via die bonding, a low temperature joining and sealing process. This die attacher is precise and efficient, capable of accurately positioning and attaching a variety of dies to substrates in a single operation. With its advanced digital control equipment, the die attacher can precisely control and optimize its die bonding process, including die tilt correction and temperature control, to deliver consistent and reliable bonding quality. The die attacher has an easy-to-use interface and a compact design, making it suitable for use in production environments. The machine uses a standard pressure plate with four optical lasers to provide precise die bonding control during the bonding process. The pressure plate is mounted on a rail system, which allows for quick and precise alignment, and it is equipped with a short, high accuracy X-Y stage for precise die placement. Additionally, the die attacher is equipped with a pre-heating unit and a tilt detection machine to minimize tilt errors. The die attacher is capable of bonding dies to substrates in as little as two seconds. The bonding speed can be further increased with its high-speed X-Y positioning tool which can provide up to 3000 die placement operations per second. The heater element has quick heating and cooling capabilities, allowing for quick start up and shorter cycle times. The die attacher is equipped with several safety features to ensure a safe working environment. It is equipped with a safety asset to detect any anomalous occurrences during the die bonding process. Additionally, it is equipped with two safety sensors which can detect if the machine is being operated without the proper operator protection. NEC BESTEM-D01R die attacher is a reliable and precise die bonding tool. It is reliable and efficient, able to make a wide variety of die bonding processes in a fast and controlled manner. It provides a safe and precise working environment, making it suitable for use in production environments.
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