Used HITACHI / RENESAS CM 700 #293668972 for sale

HITACHI / RENESAS CM 700 is a state-of-the-art die attach machine, designed to meet the demands of modern semiconductor production. The machine is capable of handling a wide range of die sizes, from very small wafer-level die to very large packages. The machine is designed with advanced features to ensure consistent and reliable die bonding. HITACHI CM 700 is based on an advanced servo equipment, which provides precise die placement with reduced cycle time. The machine can mount various dies on substrates such as PCBS and IBs, and can accept a variety of die sizes and shapes. The multiple-axis motion of the machine enables it to perform fast and precise die placement. RENESAS CM-700 also features a Vision Alignment System (VAS), which allows for die placement accuracy of within 0.5 mm. This unit is aided by a temperature-stabilizing thermal control unit, which maintains a predictable and precise die-to-die bond interface. This ensures that the die attach process is highly repeatable. The machine also features auto-tapping that allows it to securely fix the die to the substrate. This taping component can be programmed to accommodate various die sizes and pitches. In addition, CM 700 includes a programmable vision machine that allows for better recognition of various die sizes and shapes. The machine is also equipped with several safety features, such as over-current protection and a tilt emergency stop. This ensures that the machine is always operating safely and within its designed limits. HITACHI / RENESAS CM-700 is a reliable and robust machine, designed to enable large-scale die bonding in a cost-effective and accurate manner. Its advanced features make it perfect for high-volume production, and its repeatability ensures consistency of bond quality. With HITACHI CM-700, HITACHI offers a die attach solution that can increase the efficiency and effectiveness of semiconductor production.