Used HITACHI / RENESAS CM 700H #9182935 for sale

HITACHI / RENESAS CM 700H
ID: 9182935
Wafer Size: 12"
Vintage: 2007
Die bonder, 12" Wafer loader Die transfer L/F Feel system Pressure: 5 Kg/cm Mount unit dry run Lamination unit dry run NG Tray function No kit M/H and M/S L/H and L/S Stacking Wafer ring, 12" Prebake Mapping NB Lamination stage heater 2007 vintage.
HITACHI / RENESAS CM 700H is an advanced die bonder for production and research requirements. With the ability to process a variety of material types, interconnection lengths, and weight requirements, HITACHI CM 700H is an ideal choice for a variety of applications. RENESAS CM 700H is a fully automated die bonding machine that is capable of connecting dies with precision bonding accuracy. A wide range of die sizes and weights can be processed with electrical or mechanical connections. The die bonder's automatic vision equipment is built to reliably detect and track die locations even in complex assemblies. Additionally, CM 700H's vision system can identify and distinguish among different bond types and materials. The board level electrical connections of the die bonder are fully capable of handling a variety of copper and brass alloys for a strong and resilient connection. The optically precise die bonder also offers alignment and wire bonding with a wide range of C-frame and S-frame help packages. The integration of multiple die and substrate material types can be processed with this unit's versatile multi-coupler capability. The controller allows users to easily program HITACHI / RENESAS CM 700H with simple command instructions. Users can use this machine to create and save assembly recipes that can be readily recalled and used for subsequent production runs. It also users the ability to easily spin, mirror, and scale any die bond job. HITACHI CM 700H is engineered with multiple safety features and has a touch screen turnkey operation. The tool is equipped with a self-diagnosis and service asset to ensure optimum performance. As an additional feature, it is compatible with offline program editing to create and modify assembly recipes without needing to be connected to a computer. Overall, RENESAS CM 700H is an ideal solution for die bonding accuracy and precision. This feature-rich die bonder can accommodate a variety of requirements with its precision bonding technology and efficient turnkey operation.
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