Used HITACHI / RENESAS CM 700H #9282487 for sale

HITACHI / RENESAS CM 700H is a die attacher designed for a precise and automated bonding operation. The equipment uses a highly efficient thermal compression bonding process utilizing micro and macro scale precision components. With its compact design, HITACHI CM 700H is well-suited for both laboratory scale and production line requirements. This Die Attacher is equipped with a microprocessor-controlled die-wafer stage, allowing for precise positioning of small chips and wafers up to 28x28mm. In addition, an external chip aligner is available for fine-tuning the placement of chips and wafers in the die-attacher stage. With a user friendly touch screen interface and a mechanical system to prevent chip clog, the unit can easily assist in creating a reliable production process. RENESAS CM 700H is equipped with a heavy-duty thermal compression bonding head and an advanced bonding pressure control machine. The design of the tool enables the user to pre-set different thermal compression conditions for the bonding process. The asset can also perform a variety of online checks to ensure proper bonding, such as over-destruction detection, separation detection and uniform bond force distribution. The model is also compatible with a wide variety of liquid crystalline materials for the bonding process. Additionally, the equipment can take advantage of the latest adhesive materials, such as lightcurable adhesives and solder-based pastes, which further facilitate precise and efficient production of electronic chips. CM 700H also makes use of automated quality control systems to ensure a consistent and high-quality product. The system is equipped with a built-in vision-based chip inspection unit and a scanner to monitor the adhesive removal process. This enables the machine to monitor the quality of the chip and identify any potential defects that could impact the end product. HITACHI / RENESAS CM 700H is a reliable and efficient die-attaching tool designed to meet the needs of the most demanding production processes. With its advanced features, the asset can produce superior quality electronic chips with reduced costs and quicker turn-around times. The model can also be easily integrated into existing production lines, making it an ideal choice for any electronics production process.