Used HITACHI / RENESAS CM 700H #9315947 for sale

ID: 9315947
Wafer Size: 12"
Vintage: 2007
Die bonder, 12" 2007 vintage.
HITACHI / RENESAS CM 700H Die Attacher is a die attach machine specially designed for die attach process of semiconductor packages. It provides users with efficient die attach, package-to-package joining, and other advanced packaging technologies. HITACHI CM 700H is equipped with a high-speed die attach head that can attach up to 12 packages per second. Additionally, it has an advanced die aligner which ensures precise and accurate die attach. Furthermore, the machine is capable of attach height control for added accuracy. RENESAS CM 700H also features a versatile loading equipment. It can load and unload up to 10 dices per system for efficient material feeding. This helps minimize non-value added time and improve wafer utilization. Also, because it is equipped with a vacuum transportation unit, the machine can transport dices to the attached position with greater accuracy and without the need for manual intervention. CM 700H Die Attacher also has an array of software features to increase productivity. It has a navigation machine which allows users to quickly access menu and settings, while the integrated program library allows users to easily customize the machine to suit their application requirements. Additionally, there is a safety software which monitors and controls all moving parts of the machine. This ensures a safe and reliable working environment for the operator. HITACHI / RENESAS CM 700H Die Attacher also includes a comprehensive monitoring tool that allows operators to track the performance in real-time. It is also equipped with an optional vision inspection asset which confirms the position, height, and alignment of dices after attaching them. Finally, it is compatible with other HITACHI equipment and systems, making it the ideal choice for any packaging application.
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