Used HITACHI / RENESAS CM 700H #9399184 for sale

ID: 9399184
Vintage: 2012
Die bonders 2012 vintage.
HITACHI / RENESAS CM 700H Die Attacher is a robotized die attacher designed to increase assembly productivity. The equipment is suitable for a variety of high-volume precision die attachments on a vast range of different substrates, such as surface-mount boards, flip chip boards, TAB boards and COB (chip on board) lenses. The system also provides stress-free die placement that minimizes unevenness or slippage. By achieving precise alignment to the pad, it delivers die placement accuracy within ±3μm. HITACHI CM 700H comes with a set of features that enhance productivity and accuracy simultaneously. It features two high-speed vision cameras responsible for accurate alignment to the pad before placement. It also features an automatic servo unit that is responsible for providing precise speed control during die placement. The machine also comes with an online inspection feature which can detect die surface damage while mounting. The tool needs minimal operator involvement and can be connected to a network of other similar systems integrated in a central processing unit (CPU). It also offers various automation options like in-line loading, conveyors and mechanisms, jigs, and robots. The asset offers precise, reliable and repeatable die to substrate attachment. The model is capable of handling die sizes between 0.2mm and 2mm, making it highly versatile and capable of handling a variety of tasks such as die soldering, epoxy die attach, and gold bump bonding. The equipment is also equipped with auto-calibration and bender table for precise and accurate alignment. The auto-calibration ensures precise synchronization of the highest level of accuracy during die placement. RENESAS CM 700H Die Attacher is a reliable and efficient system for die to substrate attachment. It is equipped with a host of features that provide precise and uniform die placement. The unit is suitable for a variety of substrates, including SMT boards and BGA boards, and is capable of handling a variety of die sizes, from 0.2mm to 2mm, making it highly versatile and suitable for various tasks.
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