Used HITACHI / RENESAS DB 800HSL #293663163 for sale

HITACHI / RENESAS DB 800HSL die attacher is a professional high-speed die bonding equipment that is used in the semiconductor industry to quickly and accurately attach a die (or a series of small chips) to a larger substrate, such as a circuit board. This die attacher employs a range of advanced performance features to ensure reliable and efficient die placement. HITACHI DB 800HSL is equipped with a high-density encoder that provides closed-loop precision positioning control during die placement operations. This ensures that the deposited die is precisely placed in the desired location on the substrate. Additionally, the unit features a high-speed x-y table that moves the die to the desired location within an accuracy range of 5 to 10 µm. The x-y-table control parameters can also be quickly adjusted to suit specific requirements for die placement. Another notable feature of RENESAS DB 800HSL is its fully programmable electronic vision system. This unit automatically identifies different die types, and can be used to accurately place the die without operator intervention. A variety of different vision algorithms are available, including basic alignment, layout, flow, and placement. This machine ensures that the die components are accurately placed and checked for defects prior to bonding. The unit also includes a wide range of advanced bonding techniques, such as an advanced liquid-harden wire bonding tool. This asset utilises a low-viscosity solder paste that can be quickly cured under controlled atmosphere conditions. Additionally, the air control model eliminates air bubbles from the expanded wire during the bonding process. The die is then joined to the substrate with a high-pressure bonding procedure, which is designed to minimise the potential for voids in the joint. In conclusion, DB 800HSL die attacher is a high-performance die bonding equipment that is designed to provide reliable and accurate die placement for a wide range of applications. It is equipped with advanced positioning and vision systems, as well as a range of advanced bonding techniques. As such, the unit can be relied upon to deliver consistent and reliable die placement operations.