Used NIDEC TOSOK DB-2100MEF #9384634 for sale

NIDEC TOSOK DB-2100MEF is a die attacher that uses a high resolution, high throughput, low powder, and low volume equipment that is ideal for pick up with minimal die mishandling, vacuum, and heat dissipation. The die attacher is designed to be used in a die bond process. With an optimized die catcher and nozzle adjustment, it is capable of accurately picking up and manipulating die quickly and efficiently during the pickup process. DB-2100MEF die attacher uses an advanced vision system to acquire the die position and accurately deliver it to the destination. Its vision unit and nozzle adjustment provide high levels of accuracy in the picking process, which is essential for accurate die attachment. The vision machine also allows users to align die correctly in the die catcher and ensure that die are precisely picked up. NIDEC TOSOK DB-2100MEF die attacher is equipped with a high-resolution vacuum sensor to quickly and accurately detect the position of the die. When the die is picked up, the vacuum is accurately adjusted to ensure that the die is securely held. The vacuum enables efficient die transfer to the destination without misalignment or misplacement. The die attacher is also equipped with a die preheating tool. This asset uses a heating plate to raise the temperature of the die prior to pickup. This is beneficial in improving die bond reliability and heat dissipation, helping to reduce the risk of thermal mismatches between die and package structures. The heating model is powered by a high-performance motor, which runs at a low power consumption and noise level for quieter operation. In addition, DB-2100MEF die attacher is designed with a low powder rate. This feature helps to reduce the risk of misalignment and is achieved by using an optimized die catcher powder application. The die attacher also includes a dust prevention equipment, which helps to minimize the risk of die contamination and prevents die from spreading throughout the work environment. These features make NIDEC TOSOK DB-2100MEF die attacher an ideal solution for die bond processes. Its high resolution vision system, optimized nozzle adjustment, advanced vacuum sensor, die preheating unit, and low powder rate help to ensure efficient and accurate die pickup, transfer, and secure attachment.