Used ESC ELAS #9131115 for sale

Manufacturer
ESC
Model
ELAS
ID: 9131115
Wafer Size: 6"-8"
RF / DC Sputtering system, 6"-8" RF Magnetron RF Diode operation Loadlock cryo pump, 8" Chamber, 10" Rectangular Heliarc welded 304 Stainless steel plate: 16 mm View-port: Pyrex window Pump-out port: 225 mm Diameter Load lock: 2-Level elevator Non-coated pallets loaded on upper level Processed pallets unloaded from lower level VITON O-ring Feedthrough: Linear bellows Magnetically coupled drive Drive: Hydraulics Low pressure drive Motion: Loading and unloading Fully-automatic computer controlled Capacity: Diameter wafers: 6-150 mm Diameter wafers: 4-200 mm Drive: Precision DC motor With optical encoder feedback control Chain drive Labyrinth shielded Option: DC Bias / RF Bias Coating speed: 3-350 cm/min, Bi-directional Vacuum system: Load lock CTI-CRYOGENICS Cryo-Torr 8 Vacuum pump Vacuum valve: 6" ASA (7-1/8" Diameter) Gate valve Electro-pneumatic operation Valves: 1-1/2" Bellows sealed Electro-pneumatic operation Roughing pump: 27 CFM (762 l/min) With process chamber Main chamber: CTI-CRYOGENICS Cryo-Torr 10 Vacuum pump Vacuum valve: ASA Gate valve, 10" Electro-pneumatic operation for gas throttling Load lock and cryo regeneration: 27 CFM Mechanical pump Anti-back-streaming trap for mechanical pump 1-1/2" Bellows sealed electro-pneumatic operation Etch platform: Moves vertically to engage / Disengage the pallet Cooling: Water-cooled Material: Stainless steel Insulator: Pyrex Dark space shield: Stainless steel Residual gas analyzer RF Generator: Continuously-rated and specifically designed for sputtering: 1 kW ISM Frequency: 13.56 MHz FCC and OSHA DC Magnetron power supply: ADVANCED ENERGY Pinnacle Power supply, 12 kW System performance specifications: Process parameter control ranges: Description / Minimum / Maximum / Units Sputtering pressure / 1 / 90 / Millitor Scan speed (bi-directional) / 3 / 350 / cm/min DC Sput / 100 / 12,000 / Watts RF Sput / 0.02 / 2.10 / kVA - / 0.1 / 2.00 / kW Etch revel (Note 2) / 0.02 / 1.50 / kVA - / 0.1 / 1.50 / kW DC Bias capability: Internal mechanism: DC Power DC Bias activated during DC sputtering Power supplies: 150 V.
ESC ELAS is an electrochemical etching / ashing equipment designed to meet the precision etching requirements of modern thin-film electronics. It is a robust and highly efficient etching system that uses high-density, pulsed DC power for fast, uniform processes. The unit is designed for a wide range of etching applications, including etchable thin-film materials like metals, oxides, and polymers. The process is capable of achieving an etch rate of up to several hundred nanometers per minute, with very precise control over selectivity, depth, line width, and surface roughness. ELAS machine is built on proven technology that includes a hermetically sealed, copper-jacketed torso for insulation and corrosion resistance. The unit is also equipped with an integrated heating element to maintain a stable temperature and a power-regulated etching chamber with self-adjusting pressure adjustments. This ensures uniform etching processes and facilitates repeatable results that are extremely precise. To achieve an optimal etching rate, the tool employs a wide variety of etching agencies, including chemical vapor deposition, or CVD, and high-temperature furnace processes. A separately controlled, inert atmosphere allows for longer etching times, producing deeper etches. Alternatively, short-duration etches with higher efficiency can be achieved using plasma etching in a vacuum environment. ESC ELAS asset can process a wide range of wafer sizes, from small, chip-sized pieces to large, rectangular panels. It is also equipped with an XYZ stage that allows for precise placement and fixturing of the worker during processing. The model also includes E-Beam and X-ray etching process, for more accurate etching results. All of these features combine to make ELAS an excellent choice for precision etching needs. The unit is very reliable and capable of consistently producing high-quality etching results. Furthermore, it allows users to continuously monitor the etch process through advanced diagnostics and offers high reproducibility of results. Therefore, it is ideal for high-precision electronics production applications in the industrial market.
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