Used MARCH FLEXTRAK-2MB #9185980 for sale
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ID: 9185980
Vintage: 2014
Plasma cleaners
Multiple inline plasma modules
Uniform plasma treatment
Dual lane boat handling
Ideal for pre-flip-chip underfill
(3) Axes symmetrical plasma chamber
(2) Boats/plasma cycles
Chamber maximum volume: 5.5 liters (338 in³)
Plasma processes:
Pre-flip chip underfill
Pre-die attach
Pre-wire bond
Pre-mold steps
Plasma contamination removal & cleaning:
Fluorine & other halogens
Metals & metal oxides
Organic compounds
Electrodes:
Variable electrode configurations:
Power-ground
Ground-power
Power-power
Working area: 305W x 305D mm (12W x 12D in.)
RF Power:
Standard wattage: 600 W
Frequency: 13.56 MHz
Gas control:
Flow volumes: 10, 25, 50, 100, 250 or 500 sccm
(4) MFCs
Control & interface:
Software control: EPC with PC-Based touch screen interface
Remote interface: SMEMA, SECS/GEM
Vacuum pump:
Standard dry pump: 16 cfm
Optional wet pump: 19.5 cfm
Optional purged dry pump: 16 cfm
N2 Purged pump flow: (2) slm
Process gas fitting size & type: 6.35 mm (0.25 in.) OD SWAGELOK Tube
Process gas purity: Lab or electronic grade
Process gas pressure: 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max
Purge gas fitting size & type: 6.35 mm (0.25 in.) OD SWAGELOK Tube
Purge gas purity: Lab or electronic grade N2/CDA
Purge gas pressure: 2 bar (30 psig) min to 6.9 bar (100 psig) max
Pneumatic valves fitting size & type: 6.35 mm (0.25 in.) OD SWAGELOK Tube
Pneumatic gas purity:
CDA
Oil free
Dewpoint: ≤7°C (45°F)
Particulate size: <5μm
Pneumatic gas pressure: 3.45 bar (50 psig) min to 6.89 bar (100 psig) max
Exhaust: 25.4 mm (1 in.) OD Pipe flange
SEMI: E10, S2/S8 (EH&S/Ergonomics)
Gas generators: Nitrogen, hydrogen (requires additional non-optional hardware)
Chiller
Scrubber
Power supply: 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire
CE Marked
2014 vintage.
MARCH FLEXTRAK-2MB is an etcher/asher designed for use with cleanroom production environments within the semiconductor industry. It is capable of reproducing photoresist images onto semiconductor wafers or other substrates at a resolution of 5 microns. This state-of-the-art etcher/asher offers a number of unique advantages over other available etching solutions. MARCH FLEXTRAK 2MB has a large working area of 14 inches, allowing for a wide range of photoresist processing operations. It supports both random and uniform patterning, including line-shapes, rectangles, circles, and ellipses. This ensures that images can be produced with a high level of accuracy and precision. FLEXTRAK-2MB comes equipped with advanced programmable logic circuitry, allowing for easy modifications of its etching parameters. This means that the etching process can be tuned to the specific requirements of a given application. By adjusting the etching time, resolution, power, and other parameters, it is possible to achieve superior repeatability, uniformity, and image quality. FLEXTRAK 2MB offers a number of safety features. To ensure maximum safety during operation, the unit is equipped with emergency stop capability, an automated tweezers system for handling wafers, and a back-illuminated safety glass for surveillance. The etcher/asher also features a unique chill-down system to protect the surfaces of delicate wafers from overheating. MARCH FLEXTRAK-2MB comes with a wide range of applications programming options, allowing for easy automation of the photoresist etching process. Users can utilize a variety of proprietary software programs to achieve improved throughput and process quality, while still utilizing the advanced features of MARCH FLEXTRAK 2MB. Finally, FLEXTRAK-2MB is designed with a low power consumption to help reduce environmental impact. This makes it perfect for both research and production environments where power efficiency is a priority. In conclusion, FLEXTRAK 2MB is an ideal choice for any etching operation that requires high resolution, precision, and repeatability. With its advanced features and low power consumption, it is an ideal choice for cleanroom production, research, or other industry applications.
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