Used STS / CPX Multiplex ICP #9186435 for sale

STS / CPX Multiplex ICP is an etcher/asher, or a equipment that uses XeF2 and CF4 reactive gases to etch or "burn" away targeted areas from substrates. It's designed for deep reactive-ion etching (DRIE) or deep reactive-ion ashing (DRIA) of small feature sizes up to the 150-nm range. STS Multiplex ICP performs both etching and ashing as a single unit with a high degree of accuracy and repeatability. It utilizes either or both CF4 and XeF2 gas mixtures which are delivered to the etching or ashing chamber of the system. The chamber is kept pressurized and filled with a gas mixture, and a high-powered inductively coupled plasma (ICP) is used to excite the resulting plasma, allowing it to etch or ashing the substrate. CPX Multiplex ICP has a number of advantages. It has high etch rates, low material loss, and a high degree of surface uniformity. It's capable of etching a variety of materials, including Silicon, Silicon oxide, Quartz, and glass. Additionally, the unit is designed to be used for deep etches up to 150nm deep, and is expandable, meaning additional etching or ashing chambers can be added as the need arises. The machine is also user-friendly, and can be set up in minutes for etching or ashing. The tool allows for adjustments of both etch and ashing times, power levels, and gas flow settings, allowing users to fine-tune the etching or ashing process as needed. The software interface of the asset also offers users the ability to monitor etching or ashing results in real time. Overall, Multiplex ICP is an easy-to-use and highly accurate etcher and asher model, capable of deep etching and ashing with a high degree of reproducibility and repeatability. The equipment is suited for deep etched and ashing of substrates like silicon, silicon oxide, quartz, and glass, and has the added advantage of being expandable.