Used STS / CPX Multiplex ICP #9313228 for sale

ID: 9313228
Wafer Size: 6"
Vintage: 2005
Si Etcher, 6" Pressure controller: VAT PM-7 65046-PA52-AJAI/0016 Gas module: Chamber: Ar 100SCCM O2 100SCCM SF6 300SCCM C4F8 200SCCM RF Generator: ENI ACG-3B 13.56 ENI ACG-10B-07 ADVANCED ENERGY LF-5 AE 50~460MHz Chiller: AFFINITY RWA-012L-CE35CBD4 STS Turbo pump: LEYBOLD MAG 1500CT Dry pump: EDWARDS iQDP80 Pump: VARIAN SH100 2005 vintage.
STS / CPX Multiplex ICP etchers are a type of etcher or asher that use inductively coupled plasma (ICP) technology to etch or ash a variety of photoresists and other products. This etcher is a highly efficient tool that allows for precise control over the process parameters such as the power, frequency, gas flow and pressure. STS Multiplex ICP etcher is designed with a flexible chamber that can be re-configured with different ICP sources, depending on the application and the material being processed. The ICP sources can be switched quickly, allowing for a fast changeover from one job to the next. The equipment also includes a gas delivery system and a cooling group that allows for the introduction of a variety of gases into the chamber. The gases can be used to produce a specific etch or ash pattern and can be adjusted to control the etch rate and selectivity. CPX Multiplex ICP etcher is designed with a number of features that make it ideal for a wide range of applications. The precision power control allows for improved etch or ash uniformity and enables the user to achieve highly precise substrate etching or ashing. In addition, the unit is equipped with an auto-focus feature that allows for the auto-focusing of the plasma in order to produce a uniform etch or ash. This is especially useful when processing oblique wafers. The machine also has an integrated cooling tool that helps to prevent overheating. In summary, Multiplex ICP etcher is a highly efficient etching or ashing tool that is suitable for a range of applications. It has a flexible chamber that can be easily reconfigured to suit the specific requirements of the job at hand, and the auto-focus feature and adjustable gas delivery asset provide excellent control over the etch rate and selectivity. In addition, the precision power and cooling systems allow for improved uniformity and prevent the model from overheating.
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