Used TEL / TOKYO ELECTRON TELFORMULA ALD High-K #9253032 for sale

TEL / TOKYO ELECTRON TELFORMULA ALD High-K
ID: 9253032
Wafer Size: 12"
Vertical LPCVD furnaces, 12".
TEL / TOKYO ELECTRON TELFORMULA ALD High-K is a versatile and advanced etcher/asher that is specially designed to meet the needs of researchers engaged in materials chemistry. This machine utilizes atomic layer deposition (ALD) technology to deposit thin film coatings with uniform thickness and highly precise stoichiometry. This advanced etcher/asher possesses a 10-micron resolution for minimal feature sizes, allowing for tight process control and precise results. TEL TELFORMULA ALD High-K is designed for both R&D and industrial applications, providing quick and efficient etching of substrates such as semiconductors, metals, photoresists, and more. The asher/etcher provides high selectivity and uniformity of the deposition with very high throughput. The system employs a proprietary TAFHigh-K process that is capable of depositing thin film coatings with very precise control over the film thickness and the ratio of the elements within the film. The thin film layers are then supplied with ultra-high purity, low surface energy, high dielectric constant, and other desired properties. The High-K TELFORMULA ALD system works in a manner similar to sonochemistry, leveraging thermal energy to rapidly energize the molecules and achieve a desired stoichiometry. TOKYO ELECTRON TELFORMULA ALD High-K is designed to be operated continuously in a vacuum environment, with a maximum of 10 mTorr absolute pressure. The system is equipped with an in-built high-resolution optical emission spectrometer (OES) for analyzing the properties of the depositions as they are prepared. The OES utilizes an energy dispersive technique to identify the elements present in the deposited films, as well as the film stoichiometry and thickness. This process also enables the etcher/asher to gauge the uniformity of the thin film layers across the substrate surface. TELFORMULA ALD High-K also features integrated diagnostics that provide monitoring of the processing conditions in order to achieve optimal results. This advanced etcher/asher is optimized for a wide variety of substrates, ranging from silicon wafers to sapphire layers, and offers turnkey automation for easy operation and minimal downtime. Moreover, the machine can be modified to accommodate custom ashing sequences, making it suited for even the most demanding research applications.
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