Used TEL / TOKYO ELECTRON TELFORMULA ALD High-K #9313281 for sale

TEL / TOKYO ELECTRON TELFORMULA ALD High-K
ID: 9313281
Wafer Size: 12"
Vintage: 2007
Vertical LPCVD Furnaces, 12" 2007 vintage.
TEL / TOKYO ELECTRON TELFORMULA ALD High-K is a advanced etch and asher equipment for semiconductor device fabrication. The system features a high-K, multi-chamber etch and asher, with a variety of capability, such as chemical vapor deposition (CVD), atomic layer deposition (ALD), and electrochemical deposition (ECD). The unit offers unparalleled precision and control for high-level applications such as the production of ultra-thin layers of high-K dielectric materials. TEL TELFORMULA ALD High-K offers a high-K multi-chamber etch and asher machine with a variety of capabilities and control options. The etcher/asher is designed to process multiple thin-film layers at once, with precise control over each layer's thickness and roughness. The tool is also capable of precisely patterning the layers into desired shapes by using a lithography mask. Additionally, the asset is equipped with a multi-directional plasma source that allows for greater control over the etch/ash process. The high-K multi-chamber etch and asher offers stable and uniform deposition while providing a high-quality selective etch and ash process. It also has exceptional process repeatability and provides users with multiple level etch and ash cycles. In addition, the etch/ash process by TOKYO ELECTRON TELFORMULA ALD High-K can be adapted to suit customer specific needs. The model is also equipped with a variety of process tools, including in-situ ion monitor, in-situ spectrochemical analysret, etch resist application, and atomic particles inspection. The in-situ ion monitor is an advanced analytical tool that can be used to accurately measure the concentration of ions in the chamber systems, allowing users to gain more precise control over the process. The in-situ spectrochemical analysret, on the other hand, can be used to monitor the properties of the thin-film layers. The etch resist application can be used to precisely mask specific areas before an etch or ash process, while the atomic particles inspection tool is used to measure the small particles that may remain in the chamber after the process. TELFORMULA ALD High-K is an advanced etch/asher equipment that provides users with unmatched precision, control and capabilities. It offers a variety of capabilities, such as chemical vapor deposition, atomic layer deposition, and electrochemical deposition, and is equipped with a multi-directional plasma source to allow for greater control over the etch/ash process. The system also offers multiple levels of etch/ash cycles, as well as a variety of process tools. The unit's high-K multi-chamber etch and asher provides users with supreme precision and control, making it a perfect choice for demanding applications like the production of ultra-thin layers of high-K dielectric materials.
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