Used ORC DXP-3301 #293627311 for sale

ORC DXP-3301 is an integrated top-down exposure equipment designed to enable cost-effective and efficient wafer-level IC processes. It features a 7-inch resolution, 5-micron independent resolution, and a 0.5-micron CD uniformity. In addition, it is constructed with a total of 12 precise pattern alignment points and is capable of offering up to six chuck overlap exposure. DXP-3301 has a long-lasting design, with a one-piece frame, indirect optical path, and air bag to protect its sensitive components from shock. It also utilizes multiple standardized components for easy maintenance and provides excellent total cost of ownership (TCO) with its reliable wafer-handling and low components of usage. Moreover, it is flexibly configured to meet both high resolution and high throughput needs, with fast switch algorithms and high-speed setup time. Regarding its top-down imaging systems, its Optically Controlled Imagery (OCI) lens grants an excellent depth of focus (DOF) and low image distortion ratio. Its Digital Adaptive Lighting (DAL) system ensures a high dynamic range of up to 6.5, while its Reflective Auto Illumination (RAI) increases exposure quality and minimizes flare. In terms of its automation capabilities, ORC DXP-3301 is equipped with a fully automated optical inspection and registration capability that can monitor each wafer for alignment and exposure accuracy. Additionally, it has an auto-transmission unit which expedites the entire exposure process by automatically adjusting the chuck movement, load and unload speeds. Its integration with popular positive and negative resist processing solutions further enhances its capacity to provide consistent and reliable exposure. Overall, DXP-3301 exposure machine is an ideal and comprehensive solution for cost-efficient and high-quality fabrication of ICs. Its robust design and essential features grant it an excellent TCO and ensure consistent results throughout IC glass production.