Used CANON MPA 500 Fab #9226312 for sale

CANON MPA 500 Fab is a high-performance, reliable mask aligner designed to provide advanced photolithography capabilities in the fabrication process for microelectronic components, such as high-density semiconductor devices. It incorporates an innovative Substrate Sucker equipment, allowing for precision substrate handling, and enables extremely accurate, repeatable, and highly precise photolithography. The system is also capable of applying multiple layers of features with a high degree of repeatability, tolerance, and alignment accuracy within the design envelope. The projector lens used in CANON MPA 500FAB is a high-end optics solution, offering excellent imaging qualities for alignment accuracy with full field and edge-of-field imaging. It is also capable of performing spectral imaging with light sources from ultraviolet to infrared. Continuous Pulse Laser Diode (CPLD) and Deep Ultra Violet (DUV) technologies, available in different wavelengths, have been integrated into the unit, providing dynamic exposure control flexibility. MPA-500FAB features a high-precision optical microscope and the latest high-speed data acquisition and image processing technology with low particle level contamination control. Its active aerial imaging feature ensures precise alignment of critical process geometries with improved registration process speed and accuracy. Plus, its advanced auto-focus machine, ABFR light source, and S/W enhance the tool's overall performance, allowing for higher performance and reliability. The computer-assisted maintenance (CAM) technology adopted in CANON MPA-500FAB enables quick and easy maintenance, maintenance reminders, and predictive maintenance functions to ensure proper operation and to avoid critical damage from short-term faults during production. It also provides a secure and optimized automated access asset for database management. The model also offers a novel Substrate Sucker equipment capable of complete vacuum absorption and working with one hand to ensure maximum reliability and accuracy of the substrate handling process. This, in turn, maximizes throughput, as well as accuracy and repeatability, and provides an ideal environment for both sets of placement and lift-off steps. Furthermore, MPA 500FAB enables a wide range of process capabilities and offers patented process options for process optimization. Tools include Secondary Source Method (SSM) and Match Engine (ME), which calculate substrate movement very precisely, as well as Optimized Sequence (OS) that greatly minimizes time loss during mask exchange. Finally, the system offers an almost limitless array of customization of feature sizes, mask layouts, and process sequences for design flexibility.