Used LEICA / VISTEC LDS 3300M #293652840 for sale

LEICA / VISTEC LDS 3300M is a digital mask and wafer inspection equipment, used to ensure the accuracy of integrated circuit (IC) fabrication processes. It combines advanced digital imaging technology with precision optics, providing fast and reliable results for the IC production process. The system's primary function is to inspect masks and wafers, and verify their accuracy. It uses a 5-megapixel camera to acquire an image of the IC in question. The resulting image is then processed through the built-in advanced image processing algorithms, which evaluate the features of the IC to ensure that all parameters are within the prescribed range (such as size, shape, and spacing of elements). This process also takes into account defect inspection and in-situ edge seeding. In addition, LEICA LDS3300M is capable of detecting line-width variations and IC features that may require further processing or correction. It also offers further automated analysis capabilities, such as integrated image registration, edge detection, non-destructive micro-probing, and high-resolution photomask inspections. The unit is composed of two parts: the base machine and the microscope head. The base tool contains a PC and a control board and is responsible for acquiring images and processing data. The microscope head includes the optics, illumination asset, and camera, and is responsible for acquiring the images. The model is capable of working with all mask and wafer sizes, up to 200mm in diameter. For ease of use, the equipment includes an intuitive user interface, which allows users to quickly understand the controls and easily adjust settings. In addition, the system also includes advanced software packages, such as CI-Max, that allows for advanced analysis such as Enhanced Measurements and Defect Detection. In summary, VISTEC LDS 3300 M is a powerful and comprehensive mask and wafer inspection unit, which provides accurate and reliable results for IC production. It features a 5-megapixel camera, advanced image processing algorithms, automated analysis capabilities, intuitive user interface, and advanced software packages, all of which provide users with fast, reliable results for multiple IC sizes.