Used NANOMETRICS AFT 4000 #85006 for sale

ID: 85006
Film thickness and reflectivity system Standard film types measured Single layer films: Visible 500-50,000A; UV 25-500A Double layer films: Visible Top Layer 100-30,000A; Bottom Layer 100-10,000A Single layer thick films: Visible 4-75 microns Reflectance: Visible 400-850nm Oxide on poly: UV 150-10,000A Oxide on metal: Visable 3,000-20,000A; UV 500-5,000 A.
NANOMETRICS AFT 4000 is a mask and wafer inspection equipment designed to accurately and quickly evaluate defective Mask Structures and Wafer Defects before exposing wafers to hazardous chemicals and post-processing. This system allows users to quickly inspect a mask or wafer for defects and report information for further investigation. AFT 4000 offers unparalleled performance and high level accuracy in detecting and measuring even the smallest defects in dielectrics. The unit features Quadra-Tech imaging technology that provides rapid, high resolution imaging capability. This enables NANOMETRICS AFT 4000 to generate superior images of mask patterns, layers, and 3D features on the mask or wafer being inspected. The machine is further equipped with a unique Coupled-Etch Feature Analysis tool that can detect fine structures in dielectrics and structures with as little as 2 to 6 Lambda of spacing between them. In addition, the tool also provides advanced analysis tools, such as FTIR spectroscopy, that enable users to measure exact physical and chemical compound properties of a defect. AFT 4000 also comes equipped with an optional Diagnostic Feature Analysis Tool that allows users to accurately quantify the severity of a deviation. This Tool then helps users to decide whether the defect will affect the quality of the resulting product, or whether it is a false positive that can be safely fixed in the post processing. NANOMETRICS AFT 4000 is an extremely advanced mask and wafer inspection asset that is designed to provide users with the highest level of accuracy and speed when it comes to defects assessment. Its advanced imaging and analysis capabilities enable users to easily detect and measure even the smallest defects in dielectrics, and its optional diagnostic feature analysis tool allows users to accurately identify and analyze defects before committing to the post processing.
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