Used HONEYWELL TDC 3000 #104881 for sale

HONEYWELL TDC 3000 is a state-of-the-art wafer-level packaging equipment for creating advanced semiconductor packages for electronic components. This system is capable of producing the highest package quality in the industry with its precise and accurate packaging capabilities. With TDC 3000, manufacturers can combine multiple micro-fabrication processes into one production step and minimize the number of rework and inspection cycles while achieving the highest yields. HONEYWELL TDC 3000 is designed to provide maximum flexibility to meet any requirements for complex packages. The unit utilizes advanced laser technologies to create precise and accurate cuts, vias, and contact locations with superior registration repeatability on each wafer. This enables shorter lead times for wafer-level package components for electronic applications. TDC 3000 machine is also equipped with an advanced mechanism for testing and inspecting wafer packs with unparalleled accuracy. This ensures that each package meets the highest quality control standards required for applications such as cell phone, personal computer, data storage device, and automotive electronics. HONEYWELL TDC 3000 combines miniaturization and high-level automation with its high-performance machines to reduce capital and operating costs while increasing throughput. It is also designed to simplify and streamline the changeover process when switching between different production processes. In addition to HONEYWELL advanced support services, the tool also due to its fully customizable design can be integrated with existing software applications. Furthermore, TDC 3000 has the ability to connect and interface with various controllers and systems. Overall, HONEYWELL TDC 3000 is a reliable, low-cost, and high-performance wafer processing asset designed to meet the demands of a wide range of wafer-level production lines. Its combination of state-of-the-art technologies, advanced automation, and customizable software applications make it an excellent choice for electronic packaging applications.