Used TAESUNG TSG-SE-250 #9233637 for sale

ID: 9233637
Vintage: 2017
Surface cleaning system 2017 vintage.
TAESUNG TSG-SE-250 is a wafer processing equipment specifically designed for depositing and etching materials used in semiconductor devices. This system is capable of providing high throughput and reliable performance to ensure the production of quality products. TSG-SE-250 is an automated unit that can be operated in both batch and continuous processes. The machine consists of three main components: the automated transport, the wafer processing unit, and the controller. The automated transport tool is responsible for moving the wafers through the process, while the wafer processing unit is responsible for depositing the material and etching the wafer. The controller monitors and controls the operation of the asset. TAESUNG TSG-SE-250 is designed to deposit and etch a wide variety of materials, including polysilicon, oxide, aluminum, nitride, polyimide, and other organic and inorganic films. The model is capable of depositing both thin films and thick films with thicknesses ranging from 10nm to 10microns. The equipment can also etch a variety of materials with etch rates ranging from 0.5 to 50nm per minute. TSG-SE-250 has a variety of features to ensure reliable operation and repeatable results. The system is designed with several failsafe features to protect against over- or under-etching, and the controller is capable of automatically adjusting the recipe for each wafer to account for variations in material composition or thickness. The unit also includes an array of gauges and sensors to monitor the quality of the wafer and the etching process. TAESUNG TSG-SE-250 is designed to be easy to use and is equipped with a graphical user interface (GUI) that allows users to quickly and intuitively set up and control the process. The machine also includes several data-logging and reporting features to help users analyze and optimize their process results. The tool is available in several different configurations to suit various wafer sizes and production requirements. Overall, TSG-SE-250 is an excellent choice for depositing and etching a variety of materials used in semiconductor devices. It is capable of providing high-throughput and reliable results, is easy to use and configure, and is equipped with numerous failsafe features to ensure the production of quality products.
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