Used FICO / BESI MMS-i 105 #9409218 for sale

FICO / BESI MMS-i 105 is a micro-Miniature-packaging equipment used in many areas of the electronics industry and is especially suited for manufacturing small electronic components and subsystems. The system is designed to package applications with a maximum circuit board size of only 105mm x 105mm, while still enabling an extremely compact form factor and allowing a high density of components. FICO MMS-i 105 works using a multi-level elastomeric packaging technology, which bonds both a substrate and a millimetre-thin film over the components on a circuit board using heat and pressure. This technique provides superior reliability due to the bonding between all layers of material, when compared to conventional surface mount technology. Additionally, the unit eliminates the need for traditional solder masks and solder balls. This, in turn, reduces the overall complexity of the packaging and helps to reduce cost. BESI MMS-i 105 also features a unique interconnect technology, called MDAC Packaging, which is capable of creating very small interconnects, with a diameter of only 0.2mm, as well as ensuring mechanical stability. This capability helps to significantly reduce the size and weight of the overall package and enables the machine to package extremely dense, high-precision components. In order to protect the components from the environment, MMS-i 105 also has a built-in encapsulation process. This process uses an optically-activated epoxy that seals the components into the package and provides a fully hermetic seal. This ensures that the components are protected from dust, moisture and static electricity. Overall, FICO / BESI MMS-i 105 is an excellent choice when packaging small and highly-dense components. By utilizing the multi-level packaging, MDAC interconnect and the epoxy encapsulation technology, the tool provides superior reliability while still maintaining a very small form factor. Consequently, this asset has become the preferred choice for many industries, and is often chosen for its ability to provide both cost savings and reduced design time.