Used CND PLUS CIE-4D02(04)-C #9267215 for sale

CND PLUS CIE-4D02(04)-C is a state-of-the-art photoresist equipment developed by CND (Coating and Developing Inc.), a leading provider of photochemistry materials and solutions for the industrial production of semiconductors and other integrated circuits. CND PLUS photoresist system is specifically designed for use in direct-write photolithography processes for the high-precision creation of integrated circuits and other microelectronic components. This unit utilizes a proprietary, hard-baked lithographic photoresist coating, along with CND's advanced four-layer deposition technology (4D02) to create features with an exceptionally high level of resolution and feature homogeneity. The CND 4D02 coating consists of four distinct film layers that are specifically engineered to interact with conventional photolithography processes. The four layers are designed to interact with, and modulate, the photolithographic optical elements in the projection machine to give the precise features desired by the designer in the finished product. The first layer in the 4D02 coating is a UV-blocking layer. This layer helps to create the uniformity in the lithographic process required to create small-object details and can also preclude over-exposure of the resist and contamination of the underlying silicon wafer. The second layer is a hard-baked UV-absorptive layer, which helps reduce the depth of focus and the critical dimensions (CD) required for acceptable printing. This chemical layer provides greater precision and accuracy and helps to increase yield. The third and fourth layers are a photoresist layer and a UV-enhanced etch stop layer, respectively. These layers interact to protect the underlying silicon wafer from potential overexposure and chemical attack. Together they help ensure high-quality prints with sharper feature boundaries and higher resolution than those achieved with conventional photolithography processes. CND PLUS CIE-4D02(04)-C photoresist tool is ideal for high-density, ultra-fine detail, and complex dielectric layers used in the fabrication of advanced semiconductor and microelectronic devices. Its hard-baked UV-absorptive layer helps improve resolution and reduces the CD required to achieve acceptable printing, while its four-layer coating improves lithographic uniformity and depth-of-field performance. The reduced CD specifications allow for higher yield with more complex patterns, while the protection layers help ensure improved repeatability and longer die lifetimes.