Used KARL SUSS / MICROTEC PA 200 #9254829 for sale

Manufacturer
KARL SUSS / MICROTEC
Model
PA 200
ID: 9254829
Prober, parts machine With TEMPTRONIC chuck, 6".
KARL SUSS / MICROTEC PA 200 is a prober that is designed for high-precision wafer probing and testing. This prober has a wide range of application possibilities, such as electric, optical, and mechanical characterization of semiconductor wafers, chips, and die. MICROTEC PA 200 is capable of measuring single probes in a vacuum, using high resolution imaging and electro-optic control. It also has the ability to quickly and accurately change between different probes that can be applied to a semiconductor. KARL SUSS PA-200 has a fully automated test environment, complete with a XYZ positioning stage. This stage allows for highly precise positioning of the sample so that the probe can accurately contact the sample. The XYZ stage is also fully programmable, and this allows for highly repeatable testing without the need of constant manual supervision. It also comes equipped with an automated planarity measurement equipment, assuring precise contact between the sample and the probe, even on curvatures. The prober is covered in a compact housing, which is designed to minimize vibration and temperature drift. This reduced vibration leads to more accurate results. The prober also has a high-quality thermal control system. This unit helps maintain a steady temperature range so that any wafer being tested is not affected by sudden temperature fluctuations. The large chamber is capable of containing an atmosphere of either air or other low-vacuum gases. This allows for clean measurements in different atmospheres. KARL SUSS / MICROTEC PA-200 also features a robust electrical data acquisition machine. This tool is able to measure the input and output currents and voltages of switched integrated circuits, even at high frequencies. This allows for detailed analysis of the components on the tested wafer or chip. The prober also has a variety of optical measurement systems. These systems can measure 3D topology and surface surface features. This asset is suitable for measuring and comparing the height of contact pads and bumps on the chip for reliability testing. Overall, PA-200 is an excellent prober that can be used for a variety of semiconductor wafer probing and testing applications. Its advanced features offer reliable and repeatable measurements with minimal manual supervision. Its robust electrical and optical measurement systems are able to reveal critical information about chips and wafers being tested. The prober is also covered in a compact housing that minimizes vibration and temperature drift. The thermal control unit helps maintain a steady temperature range. This makes it suitable for both air and other low-vacuum atmospheres. This prober is ideal for laboratories and other high-precision testing applications.
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