Used SEMICS Opus III #9363162 for sale

Manufacturer
SEMICS
Model
Opus III
ID: 9363162
Wafer Size: 8"-12"
Vintage: 2010
Prober, 8"-12" Prospecting area: X: ±175 mm Y: ±165 mm Precision: X: ±1 µm Y: ±1 µm (3) Halls: Temperature range: Ambient to 150°C Environment: 25°C 2010 vintage.
SEMICS Opus III is a fully-automated die-and-frame prober developed by SEMICS Corporation. It is a compact, low-cost and multi-functional wafer and die probing equipment that offers accurate probing of all types of devices, including advanced logic circuits, SoC, and MEMs. Opus III uses an 8- micron step motor for die-positioning, providing positioning accuracy of better than 3 microns over a range of up to 3.4 mm. It also features a high-precision capacitive probe and advanced servo-scaling technology to ensure repeatable contact resistance and uniform contact force. The probe card is equipped with industry-leading edge protection for protection of probe tips and adjacent die. The system also features high-speed 2D strobing for enhanced fine-pitch probing. This supports fine-pitch probing of MEMS (Micro-Electro-Mechanical Systems) devices with intricate structures and higher capacitance ranges. The unit also supports a variety of other probing technologies such as scanning and bend/stretch probing, which are also designed for accuracy and reliability. The user interface of SEMICS Opus III is intuitive and user-friendly, providing operators with a wide range of commands and parameters. The machine incorporates a programmable/adjustable environment, allowing users to customize the prober to meet their specific application needs. It also includes a built-in graphical real-time monitor that enables real-time control of the tool. Overall, Opus III is a reliable, high-performance, low-cost wafer and die probing asset that delivers excellent accuracy and uniformity at a fraction of the cost of other systems. It is an ideal choice for applications requiring accurate and repeatable probing of small, high-density and fine-pitched devices.
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