Used SEMICS Opus III #9410028 for sale

SEMICS Opus III is a semiautomatic prober and wafer handling equipment that is capable of performing a wide range of wafer probing tasks, from basic wafer test and characterization to device and yield evaluation. The system consists of multiple high precision stages, including a top-mounted Robot-Hand™ for automated pick-up and delivery of individual wafers, an eight-axis high-layer manipulator for testing and/or probing of the wafers, a rotary positioning stage for fast alignment of the wafer, and a platform-style prober for sharp and accurate probing. In addition, Opus III has a wide range of other features, such as the ability to store several different probing programs, sophisticated die analysis and reporting tools, and support for various probing technologies, including resistance sheet probing, laser probing, and capacitance sheet probing, among others. The unit is also capable of integrating with a wide range of instruments such as basic meters and more advanced devices. SEMICS Opus III's high precision, tilt-table controlled Robot-Hand™ is designed for precise, repeatable, non-contact delivery of probe cards and wafers. It offers extended reach as well as arm size adjustment to accommodate all available probe cards. The eight-axis manipulator is designed for efficient, repeatable manipulation and testing. The machine's high-density positioning and robotic arms enable precise alignment and positioning of wafers and chips while providing flexibility and quick response. The rotary positioning feature allows for fast and precise predefined alignment reference positions. The high-precision, platform-style prober enables sharp and accurate probing of die, with exceptional thermal stability. Opus III allows for on-the-fly data collection, saving, and plotting of probe results, optimizing test times and improving accuracy. The tool comes with a sophisticated die analysis and reporting tool, allowing for comprehensive wafer analysis at the end of testing. An array of communication methods is also available, from serial and USB to GPIB, Ethernet, and IEEE 488.2 standard. Finally, SEMICS Opus III can save and analyze test data, allowing for fast and accurate device characterization or yield evaluation.