Used STEAG / MATTSON / AST Helios #293593160 for sale

ID: 293593160
Wafer Size: 12"
Vintage: 2008
Rapid Thermal Processor (RTP), 12" Missing parts: Chamber: PM1: (10) Board IGBTCB 40A Fuses PM2: Door mechanics PM1: MMC PM2: MMC PM1: 02 Sensor PM2: 02 Sensor PM1: Rotation controller PM2: Rotation controller FI: Robot controller, CURR: RR717 PM1: Pyro chiller PM1: Ring tilt mechanism lift unit PM2: Ring tilt mechanism lift unit FI: RD Cable FI: Sequencer 2008 vintage.
STEAG / MATTSON / AST Helios is a rapid thermal processor ideal for manufacturing processes such as soldering, die bonding and epoxy curing. The system is capable of applying power and temperature adjustments in a matter of seconds giving it excellent speed, accuracy and flexibility for critical assembly processes. AST Helios is a single-wafer lithography processor with a robotic arm that moves the substrate to be processed in and out of the chamber. The chamber is filled with inert gas, such as nitrogen, to maintain a low-oxygen environment. In addition, a series of onboard sensors closely monitor the ambient temperature and pressure and allow for precise adjustments to be made. To begin processing, the wafer is placed within the chamber and the robotic arm is then moved to the desired position. The monitored temperature and pressure settings are set and precision resistive heaters are then activated. This process allows for uniform heating across the substrate and produces repeatable results. STEAG Helios processor is ideal for a wide range of processes that require rapid thermal processing. For example, in soldering, the substrate is typically exposed to temperatures of up to 350°C for several seconds. This can be accomplished with Helios processor by rapidly cooling and heating the substrate, realising a fast, accurate and repeatable soldering process. The system can also be used for curing applications such as die bonding and encapsulation. A series of infrared emitters can be used to quickly heat and cure a layer of epoxy, while maintaining a uniform temperature across the entire substrate. Overall, MATTSON Helios is an excellent precision thermal processor. It is well suited for critical assembly processes such as soldering, die bonding and epoxy curing, as well as other short-duration processes like rapid thermal annealing. The onboard sensors, rapid thermal capability and precision heaters provide uniform heating and temperature control throughout the substrate and ensure repeatable, accurate and reliable results, giving manufacturers peace of mind when it comes to high-volume, high-precision production.
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