Used AMAT / APPLIED MATERIALS Centura DPS II #9189076 for sale

ID: 9189076
Wafer Size: 8"
Vintage: 2002
Metal etcher, 8" Platform type: Centura AP Chamber configuration: Chamber A & B: DPS II Metal bridge chamber, 8" Chamber C: ASP II Chamber Process chamber: Process kits: DPS II Metal parts / Chamber Ceramic Lid ESC Type: DPS II STD CESC, 8" ESC Power supply: DPS II STD Control type: APPLIED MATERIALS STD (VAT) Chamber A: 65048-PH52-AFS1 / 0583 A-664028 Chamber B: 65048-PH52-AFS1 / 0546 A-626798 EOP Type: Monochromator Transfer chamber: Robot type: VHP+ Dual blade APPLIED MATERIALS STD LCF Detector Loadlock chamber: SWLL Body: (2) SWLL Chambers EFEM: (2) Loadports ASYST Versaport 2200 Air intake system: APPLIED MATERIALS STD Intake FI Robot: APPLIED MATERIALS Kawasaki Wafer align: APPLIED MATERIALS STD Wafer out of position detection: APPLIED MATERIALS STD Remote interface: Components interface: Dry pump (Transfer chamber): IPUP Pump, ALCATEL A100L Chiller System monitor: Monitor 1 & Monitor 2 Flat panel with keyboard on stand Components: Turbo molecular pump: APPLIED MATERIALS STD BOC EDWARDS RF Power system: Source RF generator: APPLIED MATERIALS STD / APEX 3013 Frequency / Max power: 13.56MHz / 3KW Bias RF generator: APPLIED MATERIALS STD / APEX 1513 Frequency / Max power: 13.56MHz / 1.5KW RF Match box: Source: Navigator 3013 Chamber A & B: 0190-15168 Bias: Navigator 1513 Chamber A: 0190-23623 Chamber B: 0190-15167 Utility specification: Gas panel type: STD Gas panel exhaust: Top center exhaust (12) Gas lines Gas line tape heater (for liquid gas): BCL3 MFC Configuration: MFC type: Digital type MFC Maker / Model (All Chamber): UNIT MFC Gas information: Gas Size BCL3 200 CL2 200 NF3 100 HCL 100 NF3 20 N2 50 HE 100 O2 1L SF6 400 CHF3 25 CF4 50 AR 400 Axiom + chamber: Gas Size NH3 1000 O2 10000 CF4 750 N2 1L Independent helium control: APPLIED MATERIALS STD MKS 649A Electricity: AC Rack: APPLIED MATERIALS STD AC Rack Power supply: 3 φ, 208 V, 400 A, 50/60 Hz System controller: FES: FEPC FIS: Flex3 MF SBC: Flex3 CCM SBC: 166 MHz MF Controller: Mainframe devicenet I/O: Cardcage and backplane board 2002 vintage.
AMAT / APPLIED MATERIALS Centura DPS II is a dual-zone rapid thermal reactor designed for advanced materials processing in a variety of applications. It features a powerful RF generator that can generate high-power with precise temperature control for precise processing of thin films, multi-layer structures, and stacks of devices. The main function of AMAT Centura DPS II is to deposit multiple layers of different materials onto a substrate in a precise and precise manner. This is done by utilizing a dual-zone configuration of the dual-zone Rapid Thermal Processor. The two zones are independent, which allows precise temperature profiles to be created in each zone. This is done by individually controlling the heaters, monitored by advanced computerized control systems. The dual-zone configuration in APPLIED MATERIALS CENTURA DPS+ II allows uniform heat distribution and precise temperature control. This is done by having both zones heat up to different temperatures, which will be determined by user-defined parameters. The RTP reactor also has the ability to contain and confine gas mixtures of different composition and concentration for precise composition controlled reactions. Centura DPS II uses active cooling to quickly cool down after each zone reaches a desired temperature for precise and consistent deposition. This multi-zone RTP configuration also allows for precise ramp up and ramp down rates for each zone, which is essential in the research of thin and thick film deposition. APPLIED MATERIALS Centura DPS II also features advanced diagnostic features that allow engineers and scientists to precisely monitor and measure the materials being processed in the RTP reactor. This monitoring is especially useful in multilayer and stack device experiments where precise layer properties are desired. CENTURA DPS+ II is a valuable tool for scientists and engineers in the advanced materials processing industry due to its precise temperature control, precise deposition rate, and precise monitoring capabilities. The reactor has been used in many applications, ranging from semiconductor device fabrication, thin film deposition, and many more. The central heating, cooling, and monitoring capabilities of AMAT CENTURA DPS+ II make it an invaluable tool in research and industrial production.
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