Used AMAT / APPLIED MATERIALS Centura DPS II #9189888 for sale
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ID: 9189888
Wafer Size: 12"
Vintage: 2006
Metal etcher, 12"
Chamber configuration:
(3) DPS II
Axiom
Chamber configuration:
Chamber A:
Chamber model: DPS II
Bias generator: AE APEX 1513, 13.56 MHz, maximum 1500 W
Bias match: AE 13.56 MHz,3 kV navigat
Source generator: AE APEX 3013, 13.56 MHz, maximum 3000 W
Source match: AE 13.56 MHz,6 kV navigat
Lid: Ceramic lid, Single gas nozzle
Turbo pump: STP-A2503PV
Throttle valve: VAT Pendulum valve DN-250
ESC: Dual zone ceramic ESC
Endpoint type: Monochromator
Cathode chiller: SMC POU
Wall chiller: SMC INR-496-016C
Process kits coating: Anodize coating
Cooling: HT 200 / FC 40
Chamber B:
Cathode chiller: SMC POU
Chamber C:
Cathode chiller: SMC POU
Wall chiller: SMC INR-496-016C
Mainframe configuration:
IPUP Type: ALCATEL A100L
Gas panel type: NextGen
VHP Robot: Dual blade
MF PC Type: CPCI
Factory interface configuration:
Frontend PC type: 306 Server
FIC PC type: 306 Server
(3) Load ports
Atmospheric robot: Yaskawa track robot
Side storage: Right side
MFC Configuration:
Chamber A:
Gas line Gas name Max flow MFC Type
Gas 1 BCL3 200 ARGD40W1
Gas 2 C2H4/HE 400 AAPGD40W1
Gas 3 NF3 200 AAPGD40W1
Gas 4 CL2 400 SC-24
Gas 5 N2_50 50 AAMGD40W1
Gas 6 N2_300 300 AAPGD40W1
Gas 7 CF4 100 AAPGD40W1
Gas 8 O2 1000 AASGD40W1
Gas 9 SF6 100 AAPGD40W1
Gas 10 CHF3 50 AANGD40W1
Gas 12 AR 400 AAPGD40W1
Chamber B:
Gas line Gas name Max flow MFC Type
Gas 1 BCL3 200 AARGD40W1
Gas 2 C2H4/HE 400 AAPGD40W1
Gas 3 NF3 200 AAPGD40W1
Gas 4 CL2 400 AARGD40W1
Gas 5 N2_50 50 AAMGD40W1
Gas 6 N2_300 300 AAPGD40W1
Gas 7 CF4 100 AAPGD40W1
Gas 8 O2 1000 AASGD40W1
Gas 9 SF6 100 AAPGD40W1
Gas 10 CHF3 50 AANGD40W1
Gas 12 AR 400 AAPGD40W1
Chamber C:
Gas line Gas name Max flow MFC Type
Gas 1 BCL3 200 AARGD40W1
Gas 2 C2H4/HE 400 AAPGD40W1
Gas 3 NF3 200 AAPGD40W1
Gas 4 CL2 400 AARGD40W1
Gas 5 N2_50 50 AAMGD40W1
Gas 6 N2_300 300 AAPGD40W1
Gas 7 CF4 100 AAPGD40W1
Gas 8 O2 1000 AASGD40W1
Gas 9 SF6 100 AAPGD40W1
Gas 10 CHF3 50 AANGD40W1
Gas 12 AR 400 AAPGD40W1
2006 vintage.
AMAT / APPLIED MATERIALS Centura DPS II is a high-energy, high-throughput plasma etch reactor specifically designed for semiconductor device fabrication. The etch rate of AMAT Centura DPS II is among the highest available in the market. This capability enables manufacturers to reduce cycle time and increase production throughput. The reactor can also reduce the temperature of the substrate during etching, thus helping to preserve the structural integrity of the semiconductor device. APPLIED MATERIALS CENTURA DPS+ II is powered by AMAT High Density Plasma (HDP) technology, providing superior uniformity across the entire substrate surface and excellent etch selectivity. This superior control of plasma-generated species also reduces defect density on the substrate. The reactor's HDP source has a low-power, pulsed electron source and multiple inductively coupled plasma sources with integrated gas control systems which provide a great deal of flexibility in substrate etching processes. Centura DPS II has a maximum substrate size of 200mmx200mm. It also provides variable pressure control, vacuum exhaust and adjustable process temperature, allowing for fine-tuned plasmaprocess conditions. Additionally, the reactor can be tuned to optimize shallow trenches, narrow cells, and other challenging features that require low ion- or laser-etch damage. The closed-loop-cartridge-type platform design helps keep the process gas clean, further helping to reduce defect formation. Its large PDLT cell and low-ion-encounter chamber design also minimize processing time and maximize production throughput. Finally, APPLIED MATERIALS set of process monitoring and optimization software helps enable both reliable and repeatable process results, meeting the most stringent industry standards.
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